Packaging materials: Molding Protocol standards: ИСО 14443, ИСО 15693 Frequency ratio: 13.56MHz RFID chip: NXP Mifare 1K S50, TI, Ultralight, etc Product size: 4mm×4mm; 5mm×6mm Product thickness: 0.5mm Antenna material: copper etching antenna (BT material substrate) Read distance: 0~50mm (depending reader,RFID chip, protocol standard, environment) Surface logo printing: laser code ( two-dimensional code, LOGO) Эш температураһы: -25℃~+80℃ (-13℉~+176℉) Температура һаҡланасаҡ: …