Pakkematerjalid: Molding Protocol standards: ISO 14443, ISO 15693 Frequency ratio: 13.56MHz RFID chip: NXP Mifare 1K S50, TI, Ultralight, etc Product size: 4mm×4mm; 5mm×6mm Product thickness: 0.5mm Antenna material: copper etching antenna (BT material substrate) Loe kaugus: 0~ 50mm (depending reader,RFID kiip, protocol standard, environment) Surface logo printing: laserkood ( kahemõõtmeline kood, LOGO) töötemperatuur: -25℃ ~ + 80 ℃ (-13℉ ~ + 176 ℉) säilitustemperatuur: …