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Dry Inlay

» RFID Inlay » Dry Inlay

  • Specifications
  • Description

Main technical parameters
Standard: ISO18000-6C(EPC Class1 Gen2)
Frequency: 860~960MHz
Chip: Alien H3 or specified
Data Set: Read and Write 100000 Times
Material: Polyimide Substrate
Size: Customizable

Packaging Details
Inside diameter of paper core: 76.2mm(3inch);
Each roll quantity: 500~1000pcs(In accordance with the actual demand);
Roll direction: The surface or printing facing out (on);
Packing material: Antistatic pearl cotton+Bubble pad+Antistatic bag+Outside.

Heat Resistant Substrate UHF Inlay is suitable for use in extremely harsh high temperature environments with excellent performance, suitable for cargo management in long-distance transportation.
Feature: Hi-temperature resistance (max to 350 celsius)

Application
Cargo transportation management
Asset tracking

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    Tel:0086 755 89823301
    Web:www.seabreezerfid.com