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Inlay garing

» RFID Inlay » Inlay garing

  • specifications
  • Description

paramèter technical utama
Standard: ISO18000-6C(EPC Class1 Gen2)
frekuensi: 860~ 960MHz
chip: H3 asing utawa kasebut
data Set: Maca lan nulis 100000 kaping
Material: Polyimide Landasan
Size: customizable

Details Packaging
Diameteripun nang saka inti kertas: 76.2mm(3inch);
Saben jumlahe muter: 500~ 1000pcs(Sesuai karo dikarepake nyata);
arah Roll: Ing lumahing utawa printing madhep metu (ing);
materi packing: Antistatic Pearl katun + Gelembung pad + tas Antistatic + Outside.

Heat Resistant Substrate UHF Inlay is suitable for use in extremely harsh high temperature environments with excellent performance, suitable for cargo management in long-distance transportation.
Feature: Hi-temperature resistance (max to 350 celsius)

aplikasi
Cargo transportation management
Asset tracking

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    RFID / IoT / Printing
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    web:www.seabreezerfid.com