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Card Around / Accessories

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RFID Chip COB Bonding, RFID Wafer Bonding, RFID COB Processing

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Can be bonding HF/LF wafers, made into bulk (grain) or COB.

nanontany
  • Specifications
  • Description

RFID Wafer: EM4102, TK4100, FM11RF08, sns.
Frequency: 125KHz/13.56MHz

RFID COB processing services: wafer bonding, COB soft plate making, COB making (the frequency is 125KHz and 13.56MHz)
Processing equipment: Automatic Die Bonder, Automatic Wire Bonder, Draught Drying Cabinet,sns.
Quantity of processing equipment: 12
Daily processing capacity: 280,000 pcs/day
The lowest market price, the fastest delivery

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    RFID / IoT / Access Control
    LF / HF / UHF
    Card / Tag / Inlay / Label
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    R / W Device
    RFID Vahaolana
    OEM / ODM

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    Tel:0086 755 89823301
    Web:www.seabreezerfid.com