zaus:
Contactless: LF 125KHz/HF 13.56MHz
Contactless Chip: EM4100/EM4102, GK4001, EM4550, Atmel T5557/T5567/T5577, Mifare Standard 1k, Mifare Standard 4k, Mifare Ultralight, Mifare DESfire, Jcop31(CPU chip), Jcop41(CPU chip), INFINEON MCC8, FM11RM08(XOA2 module ), I-CODE SLI(original), lwm yam.
Contact Chip:
Simens: SLE5542(4442)/SLE5528(4428)
Shanghai Beiling: BL4442(SLE4442 Compatible)/BL4428(SLE4428 Compatible )
Shanghai Fudan: FM4442(SLE4442 Compatible)/FM4428(SLE4428 Compatible ) or according to customer requirments.
Cardbody material: PVC/PET/PETG/ABS/Polycarbonate
Card surface process: phij, smooth, frosting
Nyiaj Laus: ISO7816 CR80 85.60×53.98×0.86mm or according to customer requirment
Dual interface card supports contact and contactless communication ways, noncontact communication way support ISO14443 Type A/Type B protocol.
Characteristic: Support for one card is multi-purpose, high safety, fast transaction, good compatible.
Contact and contactless two connectors share all sources of cards, such as Microprocessor, operating system, storage space, lwm yam. Card with the mechanism of conflict defensing, allow more cards enter the business areas at the same time.
Support multi applications, managed by independent firewall.
Support multi type of elementary files, including binary, fixed length record, variable length record, cyclic record as well as purse files.
Support multi communication protections to assure integrity and confidential.
Support multi type of access control mechanism (authentication plus password).
Support DES/3DES.
Support PBOC defined e-purse and e-deposit function.
Support ISO 14443 Type A or Type B protocol.
Support multi communication protocol, T=0 and T=1 for contact, ISO14443-4=CL for contactless
9600bps, 38400bps and others for contact interface communication rate, 106Kbps for noncontact interface communication rate.
Supports multi capacity options, 8K/16K/32Kbytes EEPROM space are available.
Luam ntawv: Offset Printing, Silkscreen Printing, Thermal printing, Ink-dav hlau luam ntawv, Printing.
Kev ruaj ntseg nta: dej, Laser ablation, Hologram/OVD, UV, Kho qhov tseeb Variable ink, Hidden barcode/Barcode mask, Qib Rainbow, Micro-phau ntawv.
Lwm tus: Tej ntaub ntawv chipta initialization/Encryption, Ntaub ntawv, Tus kheej magnetic stripe programmed, Xee npe, Barcode, Serial Serial nab npawb, Embossing, DOD code, NBS convex chaws, Die-cut.
lom zem
Muag tus Manager muag