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RFID Chip COB Bonding, RFID Wafer Bonding, RFID COB Processing

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Can be bonding HF/LF wafers, made into bulk (grain) or COB.

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  • Specifications
  • Description

RFID Wafer: EM4102, TK4100, FM11RF08, etc.
Frequency: 125KHz/13.56MHz

RFID COB processing services: wafer bonding, COB soft plate making, COB making (the frequency is 125KHz and 13.56MHz)
Processing equipment: Automatic Die Bonder, Automatic Wire Bonder, Draught Drying Cabinet,etc.
Quantity of processing equipment: 12
Daily processing capacity: 280,000 pcs/day
The lowest market price, the fastest delivery

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