Heat Resistant Substrate UHF Inlay for High Temperature

Tapulaʻa faʻapitoa faʻapitoa
Standard: ISO18000-6C(EPC Vasega1 Gen2)
e fa'aumatia fa'ailoga pe a saeia: 860~ 960MHz
Chip: Alien H3 or specified
Data Set: Read and Write 100000 Times
Meafaitino: Polyimide Substrate
Tele: Customizable

Packaging Details
Inside diameter of paper core: 76.2mm(3inch);
Each roll quantity: 500~1000pcs(In accordance with the actual demand);
Roll direction: The surface or printing facing out (on);
Packing material: Antistatic pearl cotton+Bubble pad+Antistatic bag+Outside.