EA-RFID, hohle lefatšeng.

FM S70 Chip Card, E lumellana le MF1 IC S70 Chip

LIEKETSO LE MATS'ELA:
Karete ea HF Chip , ,

Moetso oa lihlahisoa: H28

FM S70 with triple security authentication, encryption embedded control and communication logic circuit, with a high security performance.

botsisisa
  • Litlhaloso
  • Tlhaloso
  • Mesebetsi e fumanehang

Likarolo tsa Chip
Operating Frequency: 13.56MHz
Baud rate: 106Kbit/s
Operating distance: not less than 10cm (antenna geometry)
Half-duplex communication
Compliance with ISO/IEC 14443-A
M1 standard encryption algorithm
A typical transaction time: <100Mof
EEPROM:
4096×8bits of EEPROM memory cells
64 independent sectors with a security structure to support a variety of applications
Access to the storage unit flexibly defined by the user according to their own requirements
High security: triple security certification. Highly secure data communications. For hierarchical key systems within each sector to set up two separate sets of keys.
Arithmetic functions: addition and subtraction operations can be performed
High reliability:
Wipe life: > 100,000 linako
Ho boloka lintlha: > 10 lilemo

Cards parameters
Sebetsa mocheso: -20℃~+65℃
Wipe life: > 100,000 linako
Storage: > 10 lilemo
Boholo: Karete e tloaelehileng ea ISO L 85.6 × W 54 × T. 0.84(± 0.4)limilimithara, or specify the size
Boitsebiso: PVC / Abs / PET / PETG / Pampiri, 0.13terata ea koporo ea mm
Ts'ebetso ea ho akaretsa: automatic ultrasonic automatic planting line/touch welding

FM S70 chip is Shanghai Fudan Microelectronics a non-contact IC card chip, capacity of 4K×8bits, in line with ISO14443-A protocol, operating frequency 13.56MHz, working distance of not less than 10cm.FM11RF32 chip compatible with MF1 IC S70 chip cards.
FM S70 with triple security authentication, encryption embedded control and communication logic circuit, with a high security performance. Chips of 64 independent sectors, to meet more application, widely used in public transportation card, campus card and many other applications, large capacity projects.

 

Molemo oa tlholisano:
Basebetsi ba nang le boiphihlelo;
Boleng bo botle;
Theko e ntle;
Tlhahiso e potlakileng;
Bokhoni bo boholo le lihlahisoa tse fapaneng;
Amohela taelo e nyane;
Lihlahisoa tsa ODM le OEM ho latela tlhoko ea moreki.

Ho hatisa: Khatiso ea Offset, Patone enke Khatiso, Khatiso ea mebala-bala, Khatiso ea Silkscreen, Khatiso ea mocheso, Khatiso ea ink-jet, Khatiso ea dijithale.
Likarolo tsa ts'ireletso: Watermark, Ho tlosoa ha laser, Hologram / OVD, Enke ea UV, Enke ea Optical Variable, Sebaka se patiloeng sa barcode / Barcode, Mookoli o hlophiloeng, Micro-mongolo, Guilloche, Hot stamping.
Ba bang: Ho qala data ea IC chip / Encryption, Lintlha tse Fetohang, Lenaneo la makenete le etselitsoeng motho, Phanele ea ho saena, Barcode, Nomoro ea letoto, Ho khabisa, Khoutu ea DOD, Khoutu ea khokahano ea NBS, Shoa-khaola.

Foromo ea lipotso ( re tla u khutlisetsa kapele kamoo ho ka khonehang )

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Netefatso:
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