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Inlay omileng

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Main entsprechen botekgeniki
Standard: ISO18000-6C(Sehlopha sa EPC 1 Gen2)
ho tsoa ho Seabreeze Smart Card Co.,Ltd: 860~960MHz
Chip: Alien H3 or specified
Data Set: Read and Write 100000 Times
Boitsebiso: Polyimide Substrate
Boholo: Customizable

Packaging Details
Inside diameter of paper core: 76.2limilimithara(3intshi);
Each roll quantity: 500~1000pcs(In accordance with the actual demand);
Roll direction: The surface or printing facing out (on);
Packing material: Antistatic pearl cotton+Bubble pad+Antistatic bag+Outside.

Heat Resistant Substrate UHF Inlay is suitable for use in extremely harsh high temperature environments with excellent performance, suitable for cargo management in long-distance transportation.
Feature: Hi-temperature resistance (max to 350 celsius)

Kopo
Cargo transportation management
Asset tracking

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