Packaging materials: Molding Protocol standards: ISO 14443, ISO 15693 Frequency ratio: 13.56MHz RFID chip: NXP Mifare 1K S50, TI, Ultralight, etc Product size: 4mm×4mm; 5mm×6mm Product thickness: 0.5mm Antenna material: copper etching antenna (BT material substrate) Lau ʻa e mamaʻo: 0~50mm (depending reader,RFID pinati, protocol standard, environment) Surface logo printing: laser code ( two-dimensional code, FAKAʻILONGA) Mafana ʻo e ngaue: -25° C ~ + 80 ° c (-13℉~+176℉) Māfana ʻo e tauhiʻanga me: …