Main ParametersRF frequency: LF/HF/UHFEncapsulation chip: LF (125KHz): EM4102, TK4100, EM4200, EM4305, T5577, Hitag 1, Hitag 2, Hitag SHF (13.56MHz): FM11RF08, M1K S50, M 4K S70, Mf Ultralight, I-CODE2, TI2048, SRI512UHF (860MHz-960MHz): UCODE GEN2, Muli H3, Impinj M4,etc.Materials: soft siliconeSize: customizableWeight: 18l ( according to the size )Lanú: lanu pulu, kulokula, ʻuliʻuli, hinehina, engeenga, lanu Kulei, lanu mata, lanu pingikií, etc.Working temperature: -50℃~+240℃ (-58℉~+464℉)

Main technology parametersMaterial: Soft SiliconeSize: Ф65mm/Ф74mm or customizedAdjustable type: 240×19×2.2 MM, adjustment range in 16-22cmInduction distance: 5~ 20cm (fakatatau ki he ngaue ʻa e tokotaha laukonga)Founga maʻuʻanga ivi: passiveFrequency: 13.56MHzChip: NXP NTAG203, NTAG213, NTAG215, NTAG216Protocol: ISO 14443AChip Capacity(NTAG203): 168bytes (tohi: 137bytes),(1Kbit EEPROM, 16 sectors, ko e konga takitaha ʻoku 4 konga, ha kulupu ʻoku ʻi ai e lea fufu ʻa e konga takitaha pea lava ke mapuleʻi)Holoholoʻi e taimi: >100,000 timesData Storage: > …