Main imọ sile
Ilana awọn ajohunše: ISO 11785/11784, ISO 14443, ISO 15693, ISO 18000-6B / 6C
Chip igbohunsafẹfẹ: LF 125KHz / HF 13.56MHz / UHF 860-960MHz
Chip Type: ISO 11785/11784, ISO 14443, ISO 15693, ISO 18000-6B / 6C
Chip igbohunsafẹfẹ: LF 125KHz / HF 13.56MHz / UHF 860 ~ 960MHz
Chip Type: M1 S50 / S70, M1 ULT10, M1 ULT C, ICODE2 SLI / SLI-S / L-SLI / SLIX, SLIX-L, MF DesFi 2k / 4k / 8K, Ti2048, EM4102, EM4200, EM4305, EM4450, TK4100, T5557, CET5500, Hitagl, Hitag2, Hitags, FMl208 (Sipiyu),ati be be lo.
kika ijinna: LF / HF 2.5-10cm
UHF 1-10M(Ni ibamu si awọn RSS eriali ati ohun elo agbegbe)
kika akoko: 1-2ms
ṣiṣisẹ liLohun: 1-2mm sisanra mu otutu: -100℃ ~ + 130 ℃ (-148℉ ~ + 266 ℉)
2-4mm sisanra mu otutu: -100℃ ~ + 150 ℃ (-148℉ ~ + 302 ℉)
Awọn ọna ọriniinitutu: 0-95%
ìfaradà: >100,000 igba
data idaduro: >10 ọdun
mefa: ISO boṣewa kaadi L85.6mm x W54mm tabi pato awọn iwọn,apẹrẹ
apoti ohun elo: PC(polycarbonate), 0.13mm Ejò okun waya tabi Etched aluminiomu
apoti ilana: ultrasonic auto ọgbin ila / laifọwọyi Welding
PC (polycarbonate) is a new thermoplastic engineering plastic, polycarbonate having excellent performance of electrical insulation and mechanical properties, especially the impact resistance performance of the most prominent, hard, high toughness, allowing the use of a wide range of temperature (-100℃ ~ + 130 ℃), the transparency of up to 90%, known as the transparent metal, flame retardant good performance, green non-toxic, easy processing molding.
PC materials are mainly used in the field of smart cards to make green high-end IC cards.
The use of PC material for manufacturing RFID chip card, ga liLohun sooro,in the environment of high temperature will not bend, non-toxic environmental protection, beautiful and durable. You can create all kinds of size, thickness and shape, surface can be silk screen pattern, LOGO, QR code, nomba siriali.
aṣoju awọn ohun elo
Credit card, bank card, prepaid card, passport, Ọkan Kaadi Solutions, kaadi idanimọ, kekeke / ogba kaadi, kaadi akero, owo opopona, pa, awujo isakoso, Awọn ibudo epo, low temperature and high temperature operating environments,ati be be lo.
titẹ sita: aiṣedeede Printing, Patone inki Printing, Aami-awọ titẹ sita, Silkscreen Printing, gbona titẹ sita, Inki-ofurufu titẹ sita, Digital titẹ sita.
Aabo awọn ẹya ara ẹrọ: watermark, lesa ablation, Ẹlẹya / OVD, UV inki, Opitika ayípadà inki, Farasin kooduopo / Kooduopo boju, ti dọgba Rainbow, Micro-ọrọ, Guilloche, Hot stamping.
awọn miran: IC ërún data initialization / ìsekóòdù, Ayipada Data, Àdáni se adikala programed, Ibuwọlu panel, kooduopo, Nomba siriali, Embossing, DoD koodu, NBS rubutu ti koodu, Kú-ge.