Chip Features
Frecuencia funcionamiento: 13.56Mhz
Baud rate: 106Kbit/s
Operating distance: not less than 10cm (antenna geometry)
Half-duplex communication
Compliance with ISO/IEC 14443-A
M1 standard encryption algorithm
A typical transaction time: <100ms
EEPROM:
4096×8bits of EEPROM memory cells
64 independent sectors with a security structure to support a variety of applications
Access to the storage unit flexibly defined by the user according to their own requirements
High security: triple security certification. Highly secure data communications. For hierarchical key systems within each sector to set up two separate sets of keys.
Arithmetic functions: addition and subtraction operations can be performed
High reliability:
Wipe life: > 100,000 Óoxten
Ken datos: > 10 Ja'abo'ob
Cards parameters
Temperatura meyaj: -20℃~+65℃
Wipe life: > 100,000 Óoxten
Storage: > 10 Ja'abo'ob
Buka'aj: Tarjeta estándar ISO L 85.6×W 54×T 0.84(±0,4)milímetro, or specify the size
Xooko'obo': PVC/ABS/PET/PETG/Paper, 0.13mm alambre u cobre
Tuukula' encapsulación: automatic ultrasonic automatic planting line/touch welding
FM S70 chip is Shanghai Fudan Microelectronics a non-contact IC card chip, capacity of 4K×8bits, in line with ISO14443-A protocol, operating frequency 13.56MHz, working distance of not less than 10cm.FM11RF32 chip compatible with MF1 IC S70 chip cards.
FM S70 with triple security authentication, encryption embedded control and communication logic circuit, with a high security performance. Chips of 64 independent sectors, to meet more application, widely used in public transportation card, campus card and many other applications, large capacity projects.
Ventaja competitiva:
Máaxo'ob ku experimentado;
Excelente calidad;
U utsil tojol;
Ku ts'áajik rápida;
Nojoch Buka'aj u ba'al ka amplia gama yik'áalil;
K'aam chan pedido;
Yik'áalil ODM yéetel OEM bin u yaantal le cliente.
Imprenta: Impresión offset, Patone ink Printing, Spot-color printing, Serigrafía, Impresión térmica, Impresión yéetel inyección tinta, Impresión digital.
Yáantajo'ob ti' seguridad: Filigrana, Ablación yéetel láser, Holograma leti' OVD, Tinta UV, Tinta óptica u variable, Código barras oculto leti' Máscara código barras, Chéelo' graduado, Micro-texto, Guilloche, Hot stamping.
Láak'o'ob: IC chip data initialization/Encryption, Datos variables, Banda magnética personalizada programada, Panel Firma, Código barras, Meyaj ku serie, Realzando, Código DOD, Código convexo NBS, Troquelados.
Fung
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