Main technical parameters Chip type: NTAG213 / NTAG215 / NTAG216, 等. 材料: Glass fiber Epoxy resin Dielectric layer: FR-4 Flame retardant properties: V0 Size: 1020×1ミリメートル×, can be customized Storage temperature: -30°C~+80°C Working temperature: -30°C~+90°C Packing: 真空包装