Product parameters
Antenna Inlay materials: Copper, PET
Daqs: 73×23×8mm
it-tikketti jinqerdu ladarba jitqattgħu: 68×24mm
Antenna thickness: 0.01mm
Inlay thickness: 0.04mm
KHz 250KHz 375KHz 500KHz 13.56MHz Frekwenza Sħiħa Numru ID Apparat Kopja: 840~960MHz
Wave absorbing material thickness: 0.2mm/0.5mm
Sponge layer thickness: 8.5mm
Paste layer: 3M adhesive
Chip parameters
Comply protocol standards: ISO 18000-6C
Fakultattiv: Alien H2/H3/H4; NXP XM/XL/HSL; Impinj M2/M3/M4/M5,etc.
Frekwenza operattiva: 915MHz
Resonant frequency: 915MHz+/-13MHz
Kapaċità tal-ħażna: 0 bits/96 bits/512 bits/2048 bits optional
Erasable: 10000 żminijiet (HSL 100000)
Ħin tal-ħażna tad-dejta: 10 snin
Veloċità tal-komunikazzjoni: 640 Kbits/s (HSL 40kbit/s)
Parametri ambjentali
Ideal storage environment: +15℃~+25℃(+59℉~+77℉)，20%RH~45%RH
Tolerate storage environment: -25℃ ~ + 50 ℃(-13℉~+122℉)，20%RH~90%RH
Tolerate working environment: -25Skaner tal-ID tal-Annimali Mini għal ISO11784(-13℉~+149℉)，20%RH~90%RH
Finished product shelf life: +20℃~+30℃,20%RH~45% RH,use sealed anti-static bag for 1 year
Withstand voltage ability: ≦5N/m㎡
Resistance to bending capacity: ≧φ20mm
Normally, electromagnetic waves touching the metal, due to strong reflection effect, The return signal of the electronic tag attached to the metal surface to the reader/writer is destroyed, making the electronic tag difficult to apply to the surface of the metal body. Developed electromagnetic wave absorbing materials for radio anti-jamming many years ago, and successfully used in RFID tags, specific instruments and other electromagnetic interference fields.
With this kind of material for production of LF, HF and UHF electronic tags, can be directly paste in the cylinder, gas tanks, vehicles license plate identification, machine identification, mold tracking, metal containers, such as identification and management.
Applikazzjonijiet
Fixed asset management, cylinder, gas tanks, vehicles license plate identification, machine identification, mold tracking, metal containers, such as identification and management.
Fung
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