Chip: EM4305 Frequency: 100~150KHz Protocol tandard: ISO 11784, ISO 11785, ISO FDX-B Work mode: R/W R/W distance: 2~10cm R/W time: 1-2ms Size: Φ20mm/25mm/30mm, thickness 1~4mm (or the designated size ) Sebetsa mocheso: -20℃~+85℃ Erasable times: >100,000 times Data Storage: >10 years Materials and production process: PVC, shell encapsulation chips and coil, ultrasonic welding International protection agreement: IP67/IP68 Weight: 1~4g