Tekanyetso ea protocol: ISO 15693/18000-3 Mokhoa 1 Sebetsa maqhubu: 13.56MHz±7kHz 2048-bits EEPROM with Block Lock feature 64-bit unique identifier (UID) Sebaka sa ho bala: up to 1.5M Working temperature: -20℃~+65℃ Erase/Write cycles: 1,000,000 linako (minimum) Ho boloka lintlha: 40 lilemo (minimum) Boholo: Karete e tloaelehileng ea ISO L 85.6 × W 54 × T. 0.84(± 0.4)mm Material: PVC/ABS/PET/PETG, 0.13mm copper wire Encapsulation process: automatic ultrasonic automatic plant line/touch welding