Main technical parametersCommunication protocol: יסאָ 14443 טיפּ א / ב, יסאָ 15693, EPC GEN2 Class 1/ ISO 18000-6CCan package low-frequency chips (125כז): TK4100, EM4200, T5577, היטאַג 2, Hitag S, etc.Can package high-frequency chips (13.56מהז): FM11RF08, M1 S50/S70, ULT, I-CODE2, NTAG215, TI2048, SRI512, etc.Can be packaged UHF chips (860MHz~960MHz): UCODE GEN2, ALIEN H3, Impinj M4, etc.Material: Soft SiliconeWorking years: > 10 yearsMaximum reading range: …