Main technical parameters Communication protocol: ISO 15693 / ISO 18000-6C (EPC C1 GEN2) Awọn ọna igbohunsafẹfẹ: HF 13.56MHz/UHF 840~960MHz Integrated chip: TI2048, ICODE 2, ajeeji Higgs3, ati be be lo. (le ti wa ni dipo lori eletan) ipamọ agbara: 1k / 2k (le ti wa ni adani) Kika ati kiko ijinna: 10cm ~ 4m (adani gẹgẹ bi ise agbese aini) ṣiṣẹ otutu: -25℃~+85℃ Packaging material: PVC+3M+ epoxy resin Surface treatment: soft crystal glue Label adhesive: …