Commonly used chip: Ingaphinda inikeze ngamasevisi enziwe ngendlela oyifisayo ukuhlangabezana nemibono nezidingo zakho ezikhethekile 203, Ingaphinda inikeze ngamasevisi enziwe ngendlela oyifisayo ukuhlangabezana nemibono nezidingo zakho ezikhethekile 213, Ingaphinda inikeze ngamasevisi enziwe ngendlela oyifisayo ukuhlangabezana nemibono nezidingo zakho ezikhethekile 215, NTAG216, FM11RF08, I-JAVA J2A040 Chip Card ene-SIM Cut, Ultralight C, I code SLI-X, Desfire 4K/8K,njll. Frequency range: 13.0MHz~14.5MHz Protocol standard: ISO/IEC14443-A, ISO15693 Memory: according to the chip Commonly used size: 4.5×4.5mm, 8×14mm, Φ6mm, Φ8mm, Φ10mm, Φ15mm, Φ20mm, Φ25mm, Φ30mm, or customized Thickness: 0.15~0.25mm Thickness with glue: 1.0~1.3mm Material: FR-4 Surface material: PCB Working mode: R/W Read/write …
Technical parametersIC chip: I-alien H4, Impinj Monza 4QT,etc.Frequency range: 860MHz~960MHz Protocol standard: EPC C1 GEN2/ISO 18000-6CWorking mode: R/W Read/write times: >100000 times Size: Φ8mm, or customized Thickness: 0.15~0.25mm Material: FR-4 Surface material: PCB Working temperature: -25℃~+95℃ Storage temperature: 0℃~+25℃