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UHF Heat Resistant Substrate RFID Inlay

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Heat Resistant Substrate UHF Inlay for High Temperature

Heat Resistant Substrate UHF Inlay for High Temperature

Main technical parameters Standard: ISO18000-6C(EPC Class1 Gen2) zaus: 860~960MHz Chip: Alien H3 or specified Data Set: Read and Write 100000 Times Material: Polyimide Substrate Size: Customizable Packaging Details Inside diameter of paper core: 76.2mm(3inch); Each roll quantity: 500~1000pcs(In accordance with the actual demand); Roll direction: The surface or printing facing out (on); Packing material: Antistatic pearl cotton+Bubble pad+Antistatic bag+Outside.

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    OEM/ODM

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