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UHF Heat Resistant Substrate RFID Inlay

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I-Substrate eNganyangekiyo kuBubushushu i-UHF yokufaka uBubushushu obuphezulu

I-Substrate eNganyangekiyo kuBubushushu i-UHF yokufaka uBubushushu obuphezulu

Main technical parameters Standard: ISO18000-6C(EPC Class1 Gen2) Rhoqo: 860~960MHz Chip: Alien H3 or specified Data Set: Read and Write 100000 Times Material: Polyimide Substrate Size: Customizable Packaging Details Inside diameter of paper core: 76.2mm(3inch); Each roll quantity: 500~1000pcs(In accordance with the actual demand); Roll direction: The surface or printing facing out (on); Packing material: Antistatic pearl cotton+Bubble pad+Antistatic bag+Outside.

  • Inkonzo yethu

    I-RFID / IoT / uLawulo loFikelelo
    LF / HF / UHF
    Ikhadi / iTag / Inlay / ilebheli
    IWristband / isitshixo
    R / W Isixhobo
    Isisombululo seRFID
    I-OEM / i-ODM

  • Inkampani

    Ngathi
    Cinezela & Imidiya
    Iindaba / Iibhloko
    Imisebenzi
    Amabhaso & Uphengululo
    Ubungqina
    Inkqubo yokuDibana

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