EA-RFID, hohle lefatšeng.

Heat Resistant Substrate UHF Inlay

» Tags » Heat Resistant Substrate UHF Inlay

UHF Inlay e hanyetsanang le Mocheso bakeng sa Mocheso o Phahameng

UHF Inlay e hanyetsanang le Mocheso bakeng sa Mocheso o Phahameng

Main technical parameters Standard: ISO18000-6C(Sehlopha sa EPC 1 Gen2) ho tsoa ho Seabreeze Smart Card Co.,Ltd: 860~960MHz Chip: Alien H3 or specified Data Set: Read and Write 100000 Times Material: Polyimide Substrate Size: Customizable Packaging Details Inside diameter of paper core: 76.2limilimithara(3intshi); Each roll quantity: 500~1000pcs(In accordance with the actual demand); Roll direction: The surface or printing facing out (on); Packing material: Antistatic pearl cotton+Bubble pad+Antistatic bag+Outside.

  • Ts'ebeletso ea rona

    RFID / IoT / Phihlelo ea Taolo
    LF / HF / UHF
    Karete / Tag / Inlay / Label
    Wristband / Keychain
    Sesebelisoa sa R ​​/ W
    Tharollo ea RFID
    OEM / ODM

  • Khampani

    Mabapi le rona
    Tobetsa & Mecha ea phatlalatso
    Litaba / Li-Blogs
    Mosebetsi
    Likhau & Litlhahlobo
    Bopaki
    Lenaneo la Bohokahanyi

  • Iteanye le rona

    Moh:0086 755 89823301
    Webosaete:www.samoknangtel.com