Main ParametersRF maqhubu: LF/HF/UHFEncapsulation chip: LF (125KHz): EM4102, TK4100, EM4200, EM4305, T5577, Hitag 1, Hitag 2, Tlanya SHF (13.56MHz): FM11RF08, M1K S50, M 4K S70, Mf Ultralight, I-KODE2, TI2048, Tlhaloso: SRI512UHF (860MHz-960MHz): UCODE GEN2, JAVA J2A040 Chip Card e nang le SIM Cut, Impinj M4, etc.Materials: silicone e bonolo: customisableWeight: 18g ( ho ya ka boholo )Mmala: putsoa, khubelu, ntsho, tšoeu, mosehla, bohlooho, botala, pinki, etc.Mocheso o sebetsang: -50℃~+240 ℃ (-58℉~+464℉)

Mekhoa e ka sehloohong ea theknolojiMaterial: Size e bonolo ea Silicone: Ф65mm/Ф74mm kapa mofuta o hlophisitsoeng o ka fetolehang: 240× 19 × 2.2 limilimithara, sebaka sa phetoho ho 16-22cmInduction hole: 5~ 20cm (ho ya ka tshebetso ya mmadi)Mokhoa oa phepelo ea matla: passiveFrequency: 13.56MHzChip: NXP NTAG203, NTAG213, NTAG215, NTAG216Protocol: ISO 14443AChip Bokhoni(NTAG203): 168li-byte (ngola: 137li-byte),(1Kbit EEPROM, 16 mafapha, lekala ka leng le 4 sengoathoana, sehlopha se seng le se seng se na le password ea sona le taolo ea phihlello)Hlakola linako: >100,000 timesData Storage: > …