Packaging materials: Molding Protocol standards: ISO 14443, ISO 15693 Frequency ratio: 13.56MHz RFID chip: NXP Mifare 1K S50, OF, Ultralight, etc Product size: 4mm×4mm; 5mm×6mm Product thickness: 0.5mm Antenna material: copper etching antenna (BT material substrate) Irakurri distantzia: 0~50 mm (depending reader,RFID txipa, protocol standard, environment) Surface logo printing: laser kodea ( two-dimensional code, LOGOA) Laneko tenperatura: -25℃ ~ + 80 ℃ (-13℉~+176 ℉) Biltegiratzeko tenperatura: …