Chip Features
Operating Frequency: 13.56MDT
Te faito o te Baud: 106Kbit/s
Operating distance: not less than 10cm (antenna geometry)
Half-duplex communication
Compliance with ISO/IEC 14443-A
M1 standard encryption algorithm
A typical transaction time: <100ms
EEPROM:
4096×8bits of EEPROM memory cells
64 independent sectors with a security structure to support a variety of applications
Access to the storage unit flexibly defined by the user according to their own requirements
High security: triple security certification. Highly secure data communications. For hierarchical key systems within each sector to set up two separate sets of keys.
Arithmetic functions: addition and subtraction operations can be performed
High reliability:
Wipe life: > 100,000 te mau hora
Tape'araa i te mau haamaramaramaraa: > 10 mau matahiti
Cards parameters
Te anuvera o te ohipa: -20℃~+65℃
Wipe life: > 100,000 te mau hora
Storage: > 10 mau matahiti
Rahi: ISO standard card L 85.6×W 54×T 0.84(±0.4)mm, or specify the size
Materia: PVC/ABS/PET/PETG/Paper, 0.13mm copper wire
Encapsulation process: automatic ultrasonic automatic planting line/touch welding
FM S70 chip is Shanghai Fudan Microelectronics a non-contact IC card chip, capacity of 4K×8bits, in line with ISO14443-A protocol, operating frequency 13.56MHz, working distance of not less than 10cm.FM11RF32 chip compatible with MF1 IC S70 chip cards.
FM S70 with triple security authentication, encryption embedded control and communication logic circuit, with a high security performance. Chips of 64 independent sectors, to meet more application, widely used in public transportation card, campus card and many other applications, large capacity projects.
Te tata'uraa:
Te mau rave ohipa aravihi;
Maitai maitai;
Moni maitai roa a'e;
Haponoraa haapaeraa maa;
Te faito rahi e te mau tau hamaniraa rau;
Farii i te ana'iraa na'ina'i;
Te mau hamaniraa ODM e OEM mai te au i te aniraa a te hoani.
Nene'iraa: Faaô i te nene'iraa, Patone ink Printing, Spot-color printing, Nene'iraa o te hi'oraa tirita, Nene'iraa i te mahana ra, Te nene'iraa i te i'oa papa'i, Te nene'iraa na ni'a i te matini.
Te mau rave'a parururaa: Tapa'o pape, Te mau tii, Mau Taataa'toa/OVD, Hoho'a inita ODE, Inita o te mau mea o te ō'o, Tapo'i huna o te hoho'a huna/tapo'i o te hoho'a huna, Anuanua, Parau papa'i teata, Guilloche, Hot stamping.
Vetahi ê: IC chip data initialization/Encryption, Variable Data, Papa'i i te mau rave'a ha'a apî, Tuhaa tuurimaraa, Ta'o o te ta'o, Numera ana'iraa, Te mau hoho'a embosing, Numera FAA'OHIPA, NBS convex code, Tapu-pohe-raa.