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Katin Around / Kaya

» Katin Around / Kaya

RFID Chip COB Bonding, RFID Wafer Bonding, RFID COB Processing

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Can be bonding HF/LF wafers, made into bulk (grain) or COB.

bincike
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  • description

RFID Wafer: EM4102, TK4100, FM11RF08, da dai sauransu.
Frequency: 125KHz / 13.56MHz

RFID COB aiki da sabis: wafer bonding, COB taushi farantin yin, COB yin (mita ne 125KHz da 13.56MHz)
Processing kayan aiki: Atomatik mutu Bonder, Atomatik Waya Bonder, Zayyana Bushewa majalisar,da dai sauransu.
Quantity na aiki kayan aiki: 12
Daily aiki iya aiki: 280,000 inji mai kwakwalwa / rana
The mafi ƙasƙanci kasuwa farashin, ya fi sauri bayarwa

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